bonding adhesive

基本解释

The main bonding technology is direct bonding, anodic bonding, adhesive bonding and eutectic bonding.
目前主要的键合技术包括直接键合、阳极键合、粘结剂键合和共晶键合。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
The invention relates to an aqueous neoprene adhesive agent and the preparation method, which belongs to the fields of the elastic bonding adhesive with porous material and the preparation.
一种水性氯丁粘合剂及其制备方法，属于弹性、多孔材料的粘接用胶及其制备领域。
ip.com

Car makers treat aluminum to increase protection from corrosion in multiple ways, but the cheapest is an adhesive bonding process that uses zinc phosphate.
FORBES: Magazine Article