internal thermal resistance

基本解释

Curves of internal thermal resistance of different typical structures vs. heating chip areas and external resistance vs. package surface areas are plotted.
绘制了多种典型结构的内热阻与发热芯片面积的关系曲线和外热阻与封装表面积的关系曲线；
We also find that under isothermal boundary condition, due to heat can be distributed in time, the internal thermal resistance and heat distribution leading role on the module temperature rises.
等温边界条件下热量能够及时散发，内部热阻和热源分布对模块温升起主导作用。
The power output of the thermal battery is most dependent on the battery internal resistance.
热电池的内阻大小直接影响着电池的负载能力。