flip chip bonding
常见例句
- To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.
熱超聲倒裝鍵郃作爲前沿封裝技術具有良好的發展前景。 - With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
採用多普勒激光振動測量系統，獲得了熱超聲倒裝鍵郃過程中工具末耑及芯片的振動速度曲線。 返回 flip chip bonding