multi wire-saw

基本解释

At present, the multi-wire saw has already replaced ID saw in longer ingot of semiconductor material slicing.
目前，在較長的矽單晶錠切割領域，多線切割機已基本取代內圓切片機。
The overall structure of multi-wire saw was analyzed and its work principle was explained. The realization diagram of hardware and software was given for control system.
分析了多線切割機的縂躰結搆，說明了它的工作原理，給出了其控制系統的硬件和軟件實現框圖。
www.cmemo.org.cn
Multi-wire slicing is a novel method in the field of wafer slicing; recently multi-wire saw has gradually replaced the method of ID saw, and become the prevailing equipment in this domain.
多絲切割是一種新型的矽片切片加工方法，近年來多絲切割已經逐漸取代內圓切割成爲矽片切片加工的主流。