mechanical polishing

基本解释

• [机] 机械抛光

英汉例句

双语例句

• Mechanical polishing: by means of high-speed polishing compound polishing with a round metal parts, in order to improve the machining process surface brightness.
  机械抛光：借助于高速旋转的抹有抛光膏的抛光轮，以提高金属制件表面光亮度的机械加工过程。
• The affections of different surface treatments by mechanical polishing, chemical etching and photoetching to the properties of electrodes have also been discussed.
  探讨了机械抛光、化学抛光和光抛光等不同表面处理方法对电极特性的影响。
• Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
  半导体器件上铜层化学机械抛光（CMP）的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。

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词组短语

短语

• electrolytic mechanical compound polishing 电解机械复合抛光
• mechanical l polishing 机械抛光
• chemical mechanical polishing process 化学机械抛光
• mechanical polishing process 机械抛光
• Chemical Mechanical Polishing 化学机械抛光;化学机械研磨;技术;研磨

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专业释义

电子、通信与自动控制技术

• 机械抛光

  Nowadays, IC technologyreaches 45nm node. Complex nano-technologies such as sub-wavelength lithographyand Chemical-Mechanical Polishing (CMP) cause more and more large processvariations and therefore seriously deteriorate the yield.
  如今，集成电路工艺到达45nm节点，随着亚波长光刻和化学机械抛光等复杂纳米工艺的普遍采用，越来越严重的工艺参数偏差造成了集成电路成品率的快速恶化。

  机械工程

• 机械抛光

地球科学

• 机械力研磨