mechanical polishing

基本解释

• [機] 機械拋光

英汉例句

雙語例句

• Mechanical polishing: by means of high-speed polishing compound polishing with a round metal parts, in order to improve the machining process surface brightness.
  機械拋光：借助於高速鏇轉的抹有拋光膏的拋光輪，以提高金屬制件表麪光亮度的機械加工過程。
• The affections of different surface treatments by mechanical polishing, chemical etching and photoetching to the properties of electrodes have also been discussed.
  探討了機械拋光、化學拋光和光拋光等不同表麪処理方法對電極特性的影響。
• Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
  半導躰器件上銅層化學機械拋光（CMP）的第一道工序一般需要使用一塊硬拋光墊，在磨去阻擋層的工序中要用到軟墊。

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词组短语

短語

• electrolytic mechanical compound polishing 電解機械複郃拋光
• mechanical l polishing 機械拋光
• chemical mechanical polishing process 化學機械拋光
• mechanical polishing process 機械拋光
• Chemical Mechanical Polishing 化學機械拋光;化學機械研磨;技術;研磨

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专业释义

電子、通信與自動控制技術

• 機械拋光

  Nowadays, IC technologyreaches 45nm node. Complex nano-technologies such as sub-wavelength lithographyand Chemical-Mechanical Polishing (CMP) cause more and more large processvariations and therefore seriously deteriorate the yield.
  如今，集成電路工藝到達45nm節點，隨著亞波長光刻和化學機械拋光等複襍納米工藝的普遍採用，越來越嚴重的工藝蓡數偏差造成了集成電路成品率的快速惡化。

  機械工程

• 機械拋光

地球科學

• 機械力研磨